Method of manufacturing an integrated lead head suspension flexure

ABSTRACT

An integrated lead head suspension flexure including a plurality of integrated leads each including at least one lead portion unbacked by the flexure spring metal layer and configured to be substantially inline with the general plane of the spring metal layer. The leads are disposed on a dielectric layer including an unbacked dielectric layer portion having a surface positioned between the major surfaces of the spring metal layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a division of U.S. patent application Ser. No.11/627,521, filed Jan. 26, 2007 now U.S. Pat. No. 7,813,082, entitledHEAD SUSPENSION FLEXURE WITH INLINE LEAD PORTIONS, which application isincorporated herein by reference in its entirety and for all purposes.

FIELD OF THE INVENTION

The present invention relates generally to magnetic disk drive headsuspensions. In particular, the present invention is a flexure includinglead portions that are substantially inline with the flexure springmetal layer, and methods for making the flexure.

BACKGROUND OF THE INVENTION

Additive processes are known for manufacturing integrated lead headsuspension flexures for magnetic disk drives. In such known processes, aflexure spring metal layer is formed from a stainless steel sheet ofmaterial. A patterned dielectric layer is then applied onto the springmetal layer, and conductive leads or traces are deposited onto thedielectric layer. Portions of the spring metal layer opposite the leadsare subsequently etched away to form so-called “flying lead” portionsthat are not directly backed by the stainless steel spring metal layer.

There is a continuing need for improved disk drive head suspensionflexures and methods for making such improved flexures. In particular,there is a need for a disk drive head suspension flexure exhibitingimproved flexural characteristics and reduced stresses in its unbackedlead portions.

SUMMARY OF THE INVENTION

The present invention is an integrated lead head suspension flexurehaving improved flexural characteristics and reduced stresses in itsunbacked lead portions, and a method for manufacturing the flexure. Inthe improved flexure, the unbacked lead portions are positionedsubstantially inline with the spring metal layer of the flexure. In oneembodiment, the improved flexure comprises a spring metal layer having afirst surface and a second surface opposite the first surface. Theflexure further comprises a dielectric layer including a firstdielectric portion on the spring metal layer and a second dielectricportion unbacked by the spring metal layer, and a plurality ofconductive leads on the dielectric layer. Each lead includes a firstlead portion on the first dielectric portion, and a second lead portionon the second dielectric portion. At least part of the second dielectricportion or part of the second lead portion is positioned between thefirst and second surfaces of the spring metal layer.

Another embodiment of the invention is a method for manufacturing theflexure. The method comprises forming a spring metal layer having afirst surface and a second surface opposite the first surface, andforming at least one conductive lead on the flexure. The lead includes afirst lead portion backed by the spring metal layer, and a second leadportion unbacked by the spring metal layer. At least one surface of thesecond lead portion is positioned between the first and second surfacesof the spring metal layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a distal end portion of an integrated lead headsuspension flexure having in-line lead portions according to oneembodiment of the present invention.

FIG. 2 is a cross-sectional elevation view of a portion of the flexureof FIG. 1 taken at the line 2-2 in FIG. 1.

FIG. 3 is a flowchart illustrating a method of manufacturing the flexureof FIG. 1 according to one embodiment of the present invention.

FIGS. 4 through 10 are schematic side cross-sectional views of a portionof the flexure of FIG. 1 illustrating the sequential manufacturingprocess steps described in FIG. 3.

FIG. 11 is a schematic side cross-sectional view of a portion of anintegrated lead head suspension flexure according to another embodimentof the present invention.

FIG. 12 is a schematic side cross-sectional view of a portion of anintegrated lead head suspension flexure according to still anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a plan view of a distal end portion of an integrated lead headsuspension flexure 10 according to one embodiment of the presentinvention. As shown, the flexure 10 includes a generally flat springmetal layer 20 including a gimbal region 26 in its distal end portion.As further shown, the flexure 10 includes a plurality of conductivetraces or leads 40 overlaying portions of the spring metal layer 20.

As will be described and shown in detail below, portions of the leads 40that are unbacked by (i.e., not overlaying) the spring metal layer 20are, according to the various embodiments of the present invention,positioned so as to be substantially inline or co-planar with thegeneral plane of the spring metal layer 20. This configurationadvantageously locates the leads 40 more proximate the neutral axis ofthe spring metal layer 20 as compared to conventional flexures in whichthe leads are positioned significantly above the spring metal layer. Asa result, bending stresses in the unbacked portions of the leads 40 aresignificantly lower than in flexures in which corresponding leadportions are positioned significantly above or below the neutral axis ofthe spring metal layer.

As will be appreciated, the spring metal layer 20 includes a proximalmounting region (not shown) configured for attachment to a load beam(not shown) of a disk drive head suspension. Such attachment may beeffected by any techniques known in the art (e.g., welding).Additionally, as will further be appreciated, the leads are configuredto be electrically coupled at or near their proximal regions (not shown)to other electronic components or test equipment. The spring metal layer20 and leads 40 may assume, in various embodiments, a variety of shapesand sizes without departing from the scope of the present invention.

As shown in FIG. 1, the gimbal region 26 of the spring metal layer 20includes a base region 46, a pair of lateral flexure arms 54, 58extending distally from the base region 46, a cross member 64 extendingbetween the distal ends of the flexure arms 54, 58, and aslider-receiving tongue 70 supported from the cross member 64. Asfurther shown, the tongue 70 is separated from the flexure arms 54, 58by a gap 84. The tongue 70 is configured to support a magnetic headslider (not shown) as is known in the art, and is designed to beresiliently moveable with respect to the remainder of the flexure 10 inresponse to aerodynamic forces exerted on the head slider duringoperation of the disk drive.

In the illustrated embodiment, each of the leads 40 includes one or morebacked portions 90 and at least one unbacked portion 96 disposed in thegap 84. As can be seen in FIG. 1, the backed portions 90 of the leads 40overlay the spring metal layer 20, while the unbacked portions 96 of theleads 40 do not overlay the spring metal layer 20. Additionally, each ofthe leads 40 terminates in a bond pad 104 located generally adjacent tothe distal end of the tongue 70. The bond pads 104 operate toelectrically couple the leads 40 to the head slider (not shown).Accordingly, the bond pads 104 may be configured to accept an attachmentstructure (e.g., a gold ball or solder ball) for electrically couplingthe respective leads 40 to the head slider. In various embodiments, thebond pads 104 may include coatings or outer layers of conductive metalsuch as, without limitation, gold or nickel.

The flexure 10 also includes a dielectric layer 110 disposed between theleads 40 and the spring metal layer 20. Like the leads 40, thedielectric layer 110 includes backed portions 116 overlaying the springmetal layer 20, and unbacked portions 124 corresponding to andunderlying the unbacked portions 96 of the leads 40 disposed in the gap84. The dielectric layer 110 operates to electrically isolate the springmetal layer 20 from the leads 40. As further shown, the flexure 10includes a dielectric cover layer 126 disposed over portions of theleads 40. The cover layer 126 functions as a protective coating over thecovered lead portions.

The spring metal layer 20, the leads 40, the dielectric layer 110, andthe cover layer 126 can be made from any materials known in the art orlater developed for comparable structures in head suspension flexuresmanufactured by any additive process. In one embodiment, the springmetal layer 20 is made substantially from stainless steel. In oneembodiment, the dielectric layer 110 and/or the cover layer 126 may bemade from a dielectric polymer. In one such embodiment, the dielectriclayer 110 and the cover layer 126 are made from photosensitivepolyimide. In one embodiment, the conductive leads 40 are made fromcopper or copper alloys. In other embodiments, all or portions of theleads 40 may be made of noble metals such as gold. In still otherembodiments, the leads 40 may have multi-layer structures includinglayers of different conductive materials. Other materials for the springmetal layer 20, the leads 40, and the dielectric layer 110 will beapparent to those skilled in the art based on the foregoing.

FIG. 2 is a partial cross-sectional side view of a portion of theflexure 10 taken along the line 2-2 in FIG. 1, showing the relativepositions of the spring metal layer 20 and the conductive leads 40. Asshown in FIG. 2, the spring metal layer 20 has opposed major surfaces130 and 136. Additionally, as shown, the backed portion 116 of thedielectric layer 110 is disposed on the major surface 130 of the springmetal layer 20, while the unbacked portion 124 of the dielectric layer110 is disposed in the gap 84 between the flexure arm 54 and the tongue70 (see FIG. 1). As illustrated, the dielectric layer 110 includes afirst surface 144 and a second surface 145 opposite the first surface144. In the illustrated embodiment, the first surface 144 of thedielectric layer 110 in the unbacked portion 124 is located between themajor surfaces 130, 136 of the spring metal layer 20. In otherembodiments, only the second surface 145 of the dielectric layer 10 islocated between the major surfaces 130, 136 of the spring metal layer20. In still other embodiments, both surfaces 144, 145 of the unbackeddielectric portion 116 are positioned between the major surfaces 130,136 of the spring metal layer 20.

As further shown, the conductive leads 40 are disposed on the firstsurface 144 of the dielectric layer 110 and each include a lower surface146 adjacent to and in contact with the dielectric layer first surface144. Thus, as illustrated, at least the lower surface 146 of theunbacked lead portion 96 is located between the major surfaces 130, 136of the spring metal layer 20. Accordingly, in the illustratedembodiment, the unbacked lead portion 96 and the spring metal layer 20are substantially co-planar. In some embodiments, the unbacked portions96 of the leads 40 are positioned and configured such that they arepositioned entirely between the major surfaces 130, 136 of the springmetal layer 20 (i.e., the unbacked portions 96 do not extend above themajor surface 130 or below the major surface 136 of the spring metallayer 20).

As a result of the novel lead configuration according to the variousembodiments of the present invention, the unbacked portions 96 of theleads 40 are positioned proximate the neutral axis of the spring metallayer 20. This in turn locates the neutral axis of the composite flexure10 in the region including the unbacked lead portions 96 generallyproximate the neutral axis of the spring metal layer 20. Thisconfiguration will result in lower bending stresses in the leads 40 ascompared to conventional integrated lead flexures in which the leads arepositioned substantially above the spring metal layer (i.e., offset fromthe spring metal layer by at least the thickness of the interveningdielectric layer). It will be appreciated that the unbacked lead anddielectric portions 96, 124 disposed between the flexure arm 58 and thetongue 70 (see FIG. 1) may also be configured as shown in FIG. 2.Additionally, in some embodiments, the unbacked portions of the leadsand dielectric layer may extend at least partially outside the flexurearms 54, 58 (i.e., are not disposed between the flexure arms 54, 58 andthe tongue 70). In such embodiments, the unbacked portions of the leadsand dielectric layers may also be formed to be located substantiallyinline with the spring metal layer 20 as illustrated in FIG. 2.

FIG. 3 is a flowchart illustrating a method of manufacturing the flexure10 according to one embodiment of the present invention. As shown inFIG. 3, initially, a stainless steel sheet is provided and prepared forsubsequent processing. (Block 150) Next, a temporary backing layer isapplied to a surface of the stainless steel sheet. (Block 154) Asexplained and illustrated below, the backing layer operates as aplatform for formation of the unbacked portions of the leads anddielectric layer. Next, the stainless steel sheet is etched to partiallyform the flexure spring metal layer and to expose one or more surfacesof the backing layer. (Block 158) The dielectric layer can then beformed on the partially formed spring metal layer, with the portionscorresponding to the unbacked dielectric portions deposited on andsupported by the surfaces of the backing layer exposed by the precedingetching step. (Block 164) Next, the conductive leads are formed on theflexure. (Block 170) The cover layer can then be applied to the leads asappropriate. (Block 176) The temporary backing layer is then strippedfrom the spring metal layer to substantially complete the formation ofthe unbacked lead portions. (Block 184) From there, additionalprocessing steps (e.g., additional stainless steel etching steps) areperformed to complete the flexure. (Block 190)

FIGS. 4 through 10 are schematic side cross-sectional views of a portionof the flexure 10 illustrating, schematically, the sequentialmanufacturing steps set forth in FIG. 3. As shown in FIG. 4, initially,a stainless steel sheet 200 is provided and includes opposed surfacescorresponding to the major surfaces 130, 136 of the spring metal layer20. Next, as shown in FIG. 5, a backing layer 206 is applied to themajor surface 136 of the stainless steel sheet 200. The backing layer206 provides a temporary platform for subsequent formation of theunbacked portions 124, 96 of the dielectric layer 110 and the leads 40(see FIG. 2). The backing layer 206 may be made from any material havingsuitable strength and resistance to etching processes subsequentlyperformed on the stainless steel sheet 200. In one embodiment, thebacking layer 206 is a coating made substantially or entirely oftitanium or a titanium alloy. In another embodiment, the backing layer206 may be made from a polyester film such as a Mylar®. The backinglayer 206 may be applied to the stainless steel sheet 200 using anysuitable method, such as any known lamination process.

Next, as shown in FIG. 6, an etching process is performed on thestainless steel sheet 200 to partially form the spring metal layer 20,and in particular, to form the gap 84, e.g., as between the flexure arms54, 58 and the tongue 70 (see FIG. 1). In the illustrated embodiment, aportion of the stainless steel sheet 200 is etched through its entirethickness so as to provide an exposed surface 214 of the underlyingbacking layer 206 below the gap 84. This etching step can beaccomplished using any methods, whether now known or later developed,for forming stainless steel flexure structures by etching. Such methodscan include, without limitation, photolithography, ferric chloride-basedetching, and the like.

As shown in FIG. 7, the dielectric layer 110 is next formed on thepartially formed spring metal layer 20. The dielectric layer 110 can beapplied using any techniques now known or later developed for applyingdielectric materials to stainless steel. In one embodiment, thedielectric layer 110 is formed on the spring metal layer 20 using aphotosensitive polyimide material and known photolithography processes.

As can be seen in FIG. 7, the backed portion 116 of the dielectric layer110 is disposed on the major surface 130 of the spring metal layer 20,while the unbacked portion 124 of the dielectric layer 110 is disposedin the gap 84 and on the exposed surface 214 of the backing layer 206.As further shown, the unbacked portion 124 is deposited to a thickness tsuch that its first surface 144 lies between the major surfaces 130, 136of the spring metal layer 20.

In some embodiments, a seed layer (not shown) may be applied to thefirst surface 144 of the dielectric layer 110 to facilitate subsequentformation of the leads. When present, the seed layer may be made fromconductive material such as chromium or other suitable material, and maybe deposited using a vacuum deposition process or other known process toapply seed layer material onto the surface of the flexure structures. Insome embodiments, the seed layer is omitted.

Next, as illustrated in FIG. 8, the conductive leads 40 are applied tothe dielectric layer 110. The leads 40 may be applied using any methods,whether now known or later developed, for applying conductive leads toflexures by an additive process. In one exemplary embodiment, the majorsurface 130 of the spring metal layer 20 and the first surface 144 ofthe dielectric layer 110, respectively, are masked usingphotolithography techniques to define the desired pattern for the leads40. The leads 40 can then be plated to the flexure 10 using conventionalelectroplating or electroless plating processes, and the mask materialcan be removed. Other methods for applying the leads 40 to the flexure10 will apparent to those skilled in the art based on the foregoing.

As shown in FIG. 8, because the unbacked lead portion 96 is deposited onthe dielectric layer first surface 144, which in turn is positionedbetween the major surfaces 130, 136 of the spring metal layer 20, atleast the lower surface 146 of the unbacked lead portion 96 is alsopositioned between the spring metal layer major surfaces 130, 136. As aresult, the unbacked lead portion 96 is substantially in line with thegeneral plane of the spring metal layer 20. In the illustratedembodiment, the upper surface of the unbacked lead portion 96 is locatedabove the major surface 130 of the spring metal layer 20. As discussedabove, in other embodiments, the thickness t of the unbacked dielectricportion 124 (see FIG. 7) and/or the unbacked lead portion thickness areselected such that the unbacked lead portion 96 can be positionedentirely between the major surfaces 130, 136 of the spring metal layer20.

As illustrated in FIG. 9, in the embodiment shown, the dielectric coverlayer 126 is then applied over the leads 40. As described above, thecover layer 126 may, in one embodiment, be made from a dielectricmaterial such as photosensitive polyimide, and may be deposited bysubstantially the same or identical process (e.g., photolithography)used to form the dielectric layer 110. However, any other method,whether now known or later developed, may be used to form the coverlayer 126.

Next, the backing layer is stripped from the major surface 136 of thespring metal layer 20, to substantially complete the formation of theunbacked lead portion 96. FIG. 10 illustrates the flexure 10 afterremoval of the backing layer 206. The backing layer 206 can be removedusing any suitable method, e.g., etching or mechanical means.

After removal of the backing layer 206, fabrication of the flexure 10can then proceed according to known methods and techniques. For example,additional etching processes can be performed to complete the formationof the tongue 70 and to form additional features in the spring metallayer 20 (see FIG. 1). Additionally, formation of the bond pads 104 canbe completed, including, if desired, applying additional conductivemetal layers thereon. Other manufacturing processes, such as mechanicalforming, can be performed as required.

In one embodiment, an additional processing step may include removal ofall or part of the unbacked dielectric portion 124 so as tosubstantially fully expose the unbacked lead portion 96. In one suchembodiment, the unbacked lead portion 96 may further be coated or platedwith an additional metallic plating (not shown) or other protectivecoating. The unbacked dielectric portion 124 may be removed using anysuitable process, including without limitation, etching or laserablation.

FIG. 11 is a schematic side cross-sectional view of a portion of analternative flexure 710 according to another embodiment of the presentinvention. As shown in FIG. 11, the flexure 710 includes a spring metallayer 720 having a first major surface 730 and a second major surface736, and at least one conductive lead 740 having a backed portion 790overlaying the spring metal layer 720 and an unbacked portion 796 notoverlaying the spring metal layer 720. As further shown, the flexure 710includes a dielectric layer 810 having a backed dielectric portion 816,an unbacked dielectric portion 824, a first surface 844 opposite thespring metal layer 720, and a second surface 845 opposite the firstsurface 844. The conductive lead 840 is disposed on the first surface844 of the dielectric layer 810.

The flexure 710 is otherwise substantially similar to the flexure 10above, except that only the second surface 845 of the unbackeddielectric layer portion 824 is positioned between the major surfaces730, 736 of the spring metal layer 720. Thus, in the illustratedembodiment, the unbacked lead portion 796 is not positioned between themajor surfaces 730, 736 of the spring metal layer 720, but is still moreclosely inline with the spring metal layer 720 than in conventionalflexure designs in which the entire dielectric layer is positioned abovethe spring metal layer. Accordingly, the neutral axis or plane of theunbacked lead portion 796 lies relatively close to the neutral axis ofthe spring metal layer 720 as compared to such conventional flexuredesigns. And in turn, as discussed above, the neutral axis of theflexure 710 as a whole is, in the region of the unbacked lead portion796, also located more proximate the neutral axis of the spring metallayer 720 as compared to such conventional flexures.

The unbacked lead and dielectric portions 796, 824 of the flexure 710can be manufactured using any suitable method. In one embodiment, thespring metal layer 720 can be etched through its thickness in the areacorresponding to the unbacked lead and dielectric portions 796, 824,such that the remaining spring metal layer material operates as abacking layer for the unbacked dielectric layer portion 824. Thedielectric layer 810 can then be formed to a substantially uniformthickness, and the conductive lead 740 can be formed on the dielectriclayer 810. The remaining portion of the spring metal layer 720 operatingas a backing layer can then be etched away to expose the unbackeddielectric portion 824.

In another embodiment, the unbacked lead and dielectric layer portions796, 824 can be formed by mechanical forming processes. In one suchembodiment, the dielectric layer 810 and the conductive lead 740 can beformed on the spring metal layer 720, the region of the spring metallayer 720 underlying the unbacked dielectric and lead portions 824, 796can be etched away. The unbacked dielectric and lead portions 824, 796can then be mechanically formed such that at least the second surface845 of the unbacked dielectric layer 824 is positioned between the majorsurfaces 730, 736 of the spring metal layer 720. In such an embodiment,the positions of the unbacked dielectric and lead portions 824, 796relative to the major surfaces 730, 736 of the spring metal layer 720can be controlled based on the magnitude of the applied mechanicalforming force. It will be appreciated that the mechanical formingprocess just described may, in various embodiments, also be used to formthe unbacked lead and dielectric portions 96, 124 of the flexure 10described above.

FIG. 12 is a schematic side cross-sectional view of a portion of analternative flexure 910 according to another embodiment of the presentinvention. As shown in FIG. 12, the flexure 910 includes a spring metallayer 920 having a first major surface 930 and a second major surface936, and at least one conductive lead 940 having a backed portion 990overlaying the spring metal layer 920 and an unbacked lead portion 996not overlaying the spring metal layer 920. As further shown, the flexure910 includes a dielectric layer 1010 having a backed dielectric portion1016, an unbacked dielectric portion 1024, a first surface 1044 oppositethe spring metal layer 920, and a second surface 1045 opposite the firstsurface 1044. The conductive lead 1040 is disposed on the first surface1044 of the dielectric layer 1010. The flexure 910 is otherwisesubstantially similar to the flexures 10 and/or 710 above, except thatthe flexure 910 further includes a second dielectric layer 1050 on theconductive lead 940, and a second conductive lead 1060 on the seconddielectric layer 1050. The flexure 910 thus has a stacked lead design.In one embodiment, the unbacked dielectric portion 924 may be removed asdescribed above. The flexure 910 can be manufactured using any of themanufacturing methods described above with respect to the flexures 10,and 710, modified to include additional steps for forming the seconddielectric layer 1050 and second conductive lead 1060.

In the embodiments described above, at least one surface of the unbackeddielectric lead and/or dielectric portions is positioned between themajor surfaces of the spring metal layer. In other embodiments of thepresent invention, however, one or more unbacked portions of thedielectric layer may be thicker than the spring metal layer. In suchembodiments, part of these unbacked dielectric layer portions may bepositioned between the major surfaces of the spring metal layer, whilethe first and second surfaces of the unbacked dielectric portions may bepositioned, respectively, above and below the major surfaces of thespring metal layer. Alternatively, in other embodiments, the unbackedlead portions may be thicker than the spring metal layer. In suchembodiments, part of the unbacked lead portions may be positionedbetween the major surfaces of the spring metal layer, while the surfacesof the unbacked lead portions may be positioned above and below themajor surfaces of the spring metal layer. In still other embodiments,the unbacked lead or dielectric portions may have substantially the samethickness as the corresponding spring metal layer, and may be positionedwith their surfaces substantially inline with the major surfaces of thespring metal layer. In all of the above embodiments, the unbacked leadportions will be positioned more in line with the spring metal layerand, accordingly, more proximate the neutral axis of the spring metallayer than in conventional flexure designs having the unbacked leadand/or dielectric portion positioned solely above the spring metallayer.

In the embodiments illustrated above, the unbacked lead portions areformed in the gimbal region of the flexure. It is emphasized, however,that any lead portions that are unbacked by the spring metal layer ofthe flexure can be configured to be substantially or fully inline withthe spring metal layer, according to the various embodiments of thepresent invention. For example, in other embodiments, the proximalportions (not shown) of the flexure may also include unbacked leadportions formed in accordance with the embodiments of the presentinvention described and shown above.

The various embodiments of the present invention offer numerousadvantages. As discussed above, locating the unbacked lead portionssubstantially inline with the spring metal layer reduces stresses inthose lead portions. Additionally, this configuration significantlydecreases the contribution of the dielectric layer, the leads, and thecover layer to the overall stiffness of the flexure in the gimbalregion, and indeed, can decrease the overall stiffness of the flexure inthis region. This decrease in the stiffness contribution of the leadsand the dielectric layer may also reduce gimbal stiffness variationcaused by manufacturing process variations. Still additionally, reducingthe overall stiffness of the flexure structure will decrease themagnitude of the stress/strain within the structure during forming,which may in turn decrease cracking and delamination of the dielectriclayer and the leads.

Flexures according to the various embodiments of the present inventionalso exhibit improved stability and adjustability as compared toconventional flexures in which the corresponding lead portions arepositioned entirely above the spring metal layer. Additionally,positioning the leads and dielectric layer closer to the neutral axis ofthe spring metal layer will reduce residual stresses within the flexurestructure after static attitude adjustment. The reduction in residualstresses will increase the stability of the adjusted static attitude.

Various modifications and additions can be made to the exemplaryembodiments discussed without departing from the scope of the presentinvention. For example, while the embodiments described above refer toparticular features, the scope of this invention also includesembodiments having different combinations of features and embodimentsthat do not include all of the described features. Accordingly, thescope of the present invention is intended to embrace all suchalternatives, modifications, and variations as fall within the scope ofthe claims, together with all equivalents thereof.

What is claimed is:
 1. A method of manufacturing an integrated lead headsuspension flexure, the method comprising: applying a backing layer to aspring metal layer, wherein the spring metal layer has a first surfaceand a second surface opposite the first surface and the backing layer isapplied to the second surface; etching at least a portion of the springmetal layer to form a gap exposing a surface of the backing layer;forming a dielectric layer, including: forming a first dielectricportion on the first surface of the spring metal layer; and forming asecond dielectric portion in the gap on the surface of the backing layersuch that at least a first surface of the second dielectric portion isdisposed between the backing layer and a level of the first surface ofthe spring metal layer; forming at least one conductive lead on thedielectric layer, including: forming a first lead portion on the firstdielectric portion; and forming a second lead portion on the firstsurface of the second dielectric portion; and removing the backinglayer.
 2. The method of claim 1 wherein applying the backing layerincludes coating the second surface of the spring metal layer with amaterial including titanium or polyester.
 3. The method of claim 1wherein etching the spring metal layer includes etching the spring metallayer to at least partially form a pair of lateral flexure arms andflexure tongue separated from the flexure arms by the gap extending overthe exposed surface of the backing layer.
 4. The method of claim 3wherein forming the dielectric layer includes forming the seconddielectric portion in a region of the gap between one of the flexurearms and the tongue.
 5. The method of claim 4 wherein forming the atleast one conductive lead includes forming a plurality of conductiveleads, each of the plurality of conductive leads terminating in amagnetic head slider bond pad.
 6. The method of claim 5 wherein formingthe dielectric layer includes forming the dielectric layer using aphotolithography process.
 7. The method of claim 6 wherein forming theplurality of conductive leads includes plating the plurality of theconductive leads on the dielectric layer.
 8. The method of claim 1 andfurther comprising removing the second dielectric portion after removingthe backing layer.
 9. A method of manufacturing an integrated lead headsuspension flexure, the method comprising: forming a spring metal layerhaving a first surface and a second surface opposite the first surface;and forming at least one conductive lead, including: forming a firstlead portion backed by the spring metal layer; and forming a second leadportion unbacked by the spring metal layer and including a surfacehaving a level located between levels of the first and second surfacesof the spring metal layer.
 10. The method of claim 9 and furthercomprising: forming a first dielectric portion on the spring metallayer; and forming a second dielectric portion unbacked by the springmetal layer and including a first surface of the second dielectricportion having a level located between levels of the first and secondsurfaces of the spring metal layer, wherein: forming the first leadportion includes forming the first lead portion on the first dielectricportion; and forming the second lead portion includes forming the secondlead portion on the first surface of the second dielectric portion. 11.The method of claim 9 wherein forming the spring metal layer includesforming a gap in the spring metal layer.
 12. The method of claim 11 andfurther comprising: forming a dielectric layer on the flexure,including: forming a first dielectric portion on the spring metal layer;and forming a second dielectric portion in the gap and including a firstsurface having a level located between levels of the first and secondsurfaces of the spring metal layer, wherein: forming the first leadportion includes forming the first lead portion on the first dielectricportion; and forming the second lead portion includes forming the secondlead portion on the first surface of the second dielectric portion. 13.The method of claim 12 wherein forming the at least one conductive leadincludes plating a plurality of conductive leads on the dielectriclayer.